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  1. Inside Intel's Chip Factory, I Saw the Future, and It's Plain Old Glass  CNET
  2. Intel seems pretty excited about glass substrates  Engadget
  3. Intel Shows Off Work on Next-Gen Glass Core Substrates, Plans Deployment Later in Decade  AnandTech
  4. Next-Gen Intel Packaging with Glass Substrates Transition Outlined  ServeTheHome
  5. View Full Coverage on Google News
Intel is developing a new foundation for processors to try to keep up with exploding demand for new computing horsepower.Intel is developing a new foundation for processors to try to keep up with exploding demand for new computing horsepower.

Inside Intel's Chip Factory, I Saw the Future, and It's Plain Old Glass - CNET

Intel Shows Off Work on Next-Gen Glass Core Substrates, Plans Deployment Later in Decade

Intel has revealed more details on its "breakthrough" glass substrate technology - a new way to manufacture processors that will dramatically boost performanceIntel has revealed more details on its "breakthrough" glass substrate technology - a new way to manufacture processors that will dramatically boost performance

Intel’s Breakthrough “Glass Substrate” Boost to Processor Performance

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Intel has announced a a glass substrate breakthrough, which will make its future chips faster and more efficient.Intel has announced a a glass substrate breakthrough, which will make its future chips faster and more efficient.

Intel seems pretty excited about glass substrates

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Intel showed its next-gen packaging with glass substrates and started to talk about the benefits it sees for large data center and AI chips

Next-Gen Intel Packaging with Glass Substrates Transition Outlined

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Intel unveils glass substrates for chips to advance Moore's Law | VentureBeat

Hamid Azimi, corporate vice president and director of substrate technology development at Intel Corporation, holds an Intel assembled glass substrate test chip at Intel's Assembly and Test Technology Development factories

Intel Unveils Industry-Leading Glass Substrates to Meet Demand for More Powerful Compute | Wire | chronicle-tribune.com

Intel has introduced glass substrates for next-generation advanced packaging, scheduled for the latter half of this decade. It will enable the continued scaling of transistors in a package and advance Moore's Law to facilitate the development of data-centric applications. Compared to current organic substrates,

Intel's new Glass Substrates to Enable 1 Trillion Transistors per Package by 2030

Intel has announced a significant breakthrough in the semiconductor industry by introducing one of the first glass substrates

Intel Intros Glass Substrates for Next-Generation Advanced Packaging - TelecomLead

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